The dizzying pace of silicon integration is pushing the Interconnect envelope. It's clear that as this trend progresses, the need for additional packaging
I/O can only be met through increased I/O density and resultant pitch reduction at both the package level and printed circuit board level.
IBM is uniquely equipped to meet this challenge. We are a recognized leader in both semiconductor technology and packaging—a category into which few (if any) other companies fall. As such, we are capable
of offering state-of-the-art interconnect architectures that very few others are capable of producing. To learn more click here.
