The attachment of chip carrier packages and other discrete components to printed wiring boards creates what is known as an electronic assembly. These
assemblies can be smaller than those found in a cellular phone or as large as a backplane that forms the core of a mainframe computer system. Recognizing the impact of ever increasing circuit densities,
IBM has the technology and process expertise to fabricate assemblies with ball grid arrays down to 1.0 mm pitch, chip scale and micro BGA packages down to 0.5 mm pitch and even chip on board with I/O pitch
as low as 225 microns. Double sided assemblies (including backplanes) are routine and are augmented by high density, high I/O connectors.
