Silicon
germanium increases
speed, reduces electronic noise, and lowers power supply requirements.
These chips can potentially integrate multiple functions, such
as cell-phone, e-mail, and Internet access on a single chip.
Copper
wires transmit electrical signals faster than aluminum in
thinner, narrower wires necessary for the ever-shrinking universe
of semiconductors. Enables a 40 percent improvement in conductivity.
Copper-based chips can help Network Infrastructure companies create
larger networks and pack more functions into their systems.
Silicon-on-insulator
(SOI) reduces
transistor capacitance, producing a 35 to 70 percent power reduction
without loss of performance.
A new method for building microchips using a material known as "low-k dielectric" meticulously shields millions of
individual copper circuits on a chip, reducing electrical "crosstalk" between wires that can hinder chip performance and waste power. This is especially important because of the need to meet the
high-performance, low-power demands of next-generation equipment and Internet servers.
