Volume 8, Number 2
Second Quarter, 2002 |
Article |
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Perspective
Release 2.0 of the IBM 133 PCI-X Bridge
The Variety of Varactor Devices Available in IBM SiGeBiCMOS Technologies
SiGe HBT Noise Parameter Comparison at 2 GHz
C4 Interconnect Advances with Chip Technology
TheGuide: IBM?s Leading-Edge ASIC Design Infrastructure
A New ASIC Timing Signoff Methodology
An Automated ESD CAD System for BiCMOS SiGeTechnology: A New Millennium for ESD Design
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Volume 7, Number 4
Fourth Quarter, 2001 |
Article |
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Perspective
IBM's Approach to Compliance and Interoperability of InfiniBand Technology
The Need for Speed: IBM's Raw Process Time Reduction Success Means Faster Turnaround Time for Customers
Taking the Lead #1: System-on-a-Chip Solutions Deployed to IBM Design Centers
Unlimited High-Speed Differential Pairs in Multilayer Ceramic Packaging for ASIC, OC192, and OC768 Applications
IBM ASICs Redefine Performance Standard for Parasitic Extraction
Memory Performance Analysis in a System-on-a-Chip Design
"Honey, I Shrunk the Supercomputer!" - The PowerPC® 440 FPU Brings Supercomputing to IBM's Blue Logic® Library
BiCMOS 5HPE: A New Silicon Germanium Technology for High-Frequency RF Applications
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Volume 7, Number 3
Third Quarter, 2001 |
Article |
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Perspective
RapidIO: The Interconnect Architecture for Networking
Using the IBM PCI-X Bridge to Create High-Performance I/O Adapters
The eNV of the Broadcast Industry!
Capitalize on the Free Processing Power in IBM's Global Positioning System Chipset
Design Migration of an 8-Mb SRAM from a 0.18-µm Copper Process in Low-k Dielectric
Spring Land Grid Array Development: An Integrated Demountable Solution
Analog and Mixed Signal Migration from SiGeHP to SiGe5AM
Testing and Qualification of ESD and Latchup in Semiconductor Chips: Keeping Pace with Advanced Technology
Parasitic Estimation in Submicron Multifinger MOSFETs
IBM's Internet Appliance Platform: A Solution for Post-PC Internet Appliances
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Volume 7, Number 2
Second Quarter, 2001 |
Article |
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Perspective
IBM Solutions for a Multi-Gbps World
Processor PCI Mezzanine Cards Shorten Time to Market and Increase Flexibility
The Hidden Benefits of IBM ASICs (cont);
Hidden Benefit #5: IT Architecture in IBM Global Design Center Scaleup
New Supply Chain Management Applications Provide Better Customer Service: Serious Gets Exciting
IBM CMOS 6SF for the Challenging Requirements of the High Energy Physics Experiments at the Large Hadron Collider
Probing the Nature of Matter with CMOS 6SF: The APV25 Readout Chip for the CMS Tracker
Device Measurement and Characterization System: Creating Unity in a Diverse Characterization World
A 600-Mb/sec/pin 512-Mb DDR2 Synchronous DRAM
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Volume 7, Number 1
First Quarter, 2001 |
Article |
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Perspective
InfiniBand — IBM Perspective and Products
The IBM PCI-X Core: Performance and Versatility
A High-Availability Solution Using the IBM PowerPC® Chipset
The Hidden Benefits of IBM ASICs (cont.);
Hidden Benefit #4: ASIC's Area-Array I/O Footprint
Compact Models for IBM's Silicon-on-Insulator Technologies
Yield and Equipment Utilization Improvements Achieved Through Fab Conversion to Carbon Fiber/CF/PEEK Wafer Carriers and Carbon Fiber/Polypropylene Storage Boxes
A Methodology for Estimating Total Off-State Leakage Current (Iddq) in CMOS Technology
On the Selection of the Optimal Threshold Voltages for Deep Submicron CMOS Technologies
ERIE, IBM's New Parasitic Model Extraction Tool
System-on-a-Chip Hardware and Software Integration: Set-top-Box Design
Lightwave of the Future: IBM's Newest Photonic Chips
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Volume 6, Number 4
Fourth Quarter, 2000 |
Article |
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Perspective
The IBM Subsystem Switch-Fabric Board
SiGe Design Verification Process
The Hidden Benefits of IBM ASICs (cont.); Hidden Benefit #3: Design for Profit
Cu-11: A Major Advance in Semiconductor Power and Performance
Very-High-Speed Electrical Testing of Complex Multichip Ceramic Substrates
Building an ESD Strategy: Bulk CMOS to SOI, Copper, Low-k, and SiGe
The Limits of Wirebond Technology: Is Flip-Chip Attach Now a Prerequisite for Advanced Packaging?
Getting to Market Faster with Rapid-Turnaround-Time Hardware
Introducing IBM's First Copper Wiring Foundry Technology: Design, Development, and Qualification of CMOS 7SF, a 0.18-µm Dual-Oxide Technology for SRAM, ASICs, and Embedded DRAM
The IBM PowerPC® 440GP System-on-Chip
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Volume 6, Number 3
Third Quarter, 2000 |
Article |
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Perspective
The Hidden Benefits of IBM ASICs: Part 1
Methodology for I/O Cell Placement and Checking in ASIC Designs Using Area-Array Power Grid
Chip Clocking Effect on Performance for IBM's SA-27E ASIC Technology
The IBM PowerPC 750CX™ : A High-Performance Microprocessor Designed for Cost Sensitive Applications
What is Fair? Bandwidth Allocation in the IBM Power Network Processor
A Novel Low-Cost Small-Form-Factor Transceiver Module
Packaging Aspects of the Litebus™ Parallel Optoelectronic Module
PREVAIL: IBM's E-Beam Technology for Next-Generation Lithography
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Volume 6, Number 2
Second Quarter, 2000 |
Article |
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Perspective
Integrating the IBM PowerPC® Control Point in the IBM Network Processor
Techniques for Enabling FPGA Emulation of IBM CoreConnect™ Designs
VCSELs Enable High-Speed Data Communications
The Real-Time Process Control System
Automated Chip-Level I/O and Test Insertion Using IBM Design-for-Test Synthesis
Wire Bond and Flip Chip: Small, Fine Pitch BGA Packages
HyperBGA™: A High Performance, Low Stress, Laminate Ball Grid Array Flip Chip Carrier
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Volume 6, Number 1
First Quarter, 2000 |
Article |
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Perspective
SiGe Comes of Age
Using Advanced Design Methodology with First-Time-Success to Speed Time-to-Market
Enhancing the Design Process Using System-on-a-Chip Capability
MLC Advanced Groundrule Design Implementation
Electronic Test Process Limited Yield
BiCMOS Fab Yield Optimization
Multilayer Ceramic MCM--The Emerging Platform for High-Speed Digital and Radio Frequency Circuit Integration
Polysilicon Planarization and Plug Recess Etching in a Decoupled Plasma Source Chamber Using Two Endpoint Techniques
Meeting IBM's PFC Emission Goals: The Challenge of Migrating the IBM Dilute NF3/He Clean into Production
A Revolutionary GPS Receiver Chipset
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